The hot press is also known as the bonding machine. According to the medium of hot pressing, it can be divided into soldering, ACF (asymmetrical conductive tape), ACP (asymmetrical conductive glue), and TBF (hot melt adhesive film). Suitable for FPC (flexible circuit board), HSC (zebra paper), TAB and LCD and PCB connection. Since the Pitch of PCB or FPC in consumer electronics tends to be small, the conventional soldering process has been difficult to meet the requirements of extremely fine hot pressing. The ACF process has been gradually applied by mobile phone designers.
Pulse heating principle, due to the special design of the surface of the welding head, the resistance of the welding surface is very small, and the current will pass through the section with the smallest resistance. By constantly changing the voltage, the current level is adjusted and it is quickly heated by the welding head.
Constant temperature hot press, pulse hot press, double station hot press, double head pulse hot press, desktop hot press, etc.
Field of use
Mobile phone manufacturer
2. Touch screen manufacturers
5. Membrane switch
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